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ST7573 Datasheet(PDF) 2 Page - Sitronix Technology Co., Ltd. |
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ST7573 Datasheet(HTML) 2 Page - Sitronix Technology Co., Ltd. |
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2 / 46 page ![]() ST7573 Ver 1.0b 2/46 2007/07/12 3. ST7573 Pad Arrangement (COG) Chip Size: 6074 µm(X) x 720µm(Y) Chip Thickness: 480 µm Bump Height: 15 µm PAD Pitch: PAD Pitch PAD Pitch 1~5 60.0 50~72 60.0 5~6 84.5 72~73 70.0 6~11 60.0 73~96 60.0 11~12 84.5 97~115 34.0 12~39 60.0 115~116 57.0 39~40 89.0 116~247 34.0 40~49 60.0 247~248 57.0 49~50 70.0 248~267 34.0 Rough layout For easy LCM design, the Power-1, Power-2 & Power-3 are identical (any one of them can be used). Power-3 has VGI, VGS, V0O, V0I, V0S, XV0O, XV0I and XV0S which are not in Power-1 or Power-2. |
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