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SW100511NJL Datasheet(PDF) 1 Page - ABC Taiwan Electronics Corp |
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SW100511NJL Datasheet(HTML) 1 Page - ABC Taiwan Electronics Corp |
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1 / 8 page ![]() REF : 20080711-B PAGE: 1 SPECIFICATION FOR APPROVAL PROD. NAME ABC'S DWG NO. ABC'S ITEM NO. WOUND CHIP INDUCTOR Ⅰ﹒CONFIGURATION & DIMENSIONS: Ⅱ﹒SCHEMATIC DIAGRAM: Ⅲ﹒MATERIALS: Ⅳ﹒GENERAL SPECIFICATION: a﹒Core:Ceramic b﹒WIRE :Enamelled copper wire (class H) c﹒Terminal: d﹒Encapsulate:Epoxy d﹒Operating temp.:-55℃----+125℃ c﹒Stopage temp.:-55℃ ----+125℃ a﹒Temp rise :15℃ max b﹒Rated current:Current cause inductance ( PCB Pattern ) Mo / Mn + Ni + Au A : 1.00 ± 0.1 B : 0.55 ± 0.1 C : 0.50 ± 0.1 D : 0.30 E : 0.20 G : 0.40 H : 0.40 I : 0.50 m/m m/m m/m m/m m/m m/m m/m m/m b a d SW1005□□□□L□-□□□ E E BOTTOM View SIDE View TOP View I I G c A F F : 0.50 m/m AR-001A drop within 10% max. Max time above 200℃ :70sec max. Max time above 230℃ :50sec max. Peak Temp:260℃ max. Temperature Rising Area Time ( seconds ) 150 0 100 50 200 150 250 50 100 +4.0 / sec max. ℃ 150 ~ 200 / 60 ~ 120sec ℃ Preheat Area Peak Temperature: 250 200 70sec max. 50sec max. 260℃ 230℃ -(1.0 ~ 5.0) / sec max. ℃ Forced Cooling Area / sec max. +2.0 ~ 4.0℃ Reflow Area e﹒Remark:Products comply with RoHS' requirements |
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