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DM562AP Datasheet(PDF) 47 Page - Davicom Semiconductor, Inc.

Part # DM562AP
Description  V.90 Integrated Data/ Fax/Voice/Speakerphone Modem Device Single Chip with Memory Built in
PDF  48 Pages
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Manufacturer  DAVICOM [Davicom Semiconductor, Inc.]
Direct Link  http://www.davicom.com.tw
Logo DAVICOM - Davicom Semiconductor, Inc.

DM562AP Datasheet(HTML) 47 Page - Davicom Semiconductor, Inc.

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DM562AP
V.90 Integrated Data/ Fax/Voice/Speakerphone
Modem Device Single Chip with Memory Built in
LQFP 48L (F.P. 2mm) Outline Dimensions
unit: inches/mm
y
D1
D
Symbol
Dimensions in inches
Dimensions in mm
Min.
Nom.
Max.
Min.
Nom.
Max.
A
-
-
0.063
-
-
1.60
A1
0.002
-
0.006
0.05
-
0.15
A2
0.053
0.055
0.057
1.35
1.40
1.45
b
0.007
0.009
0.011
0.17
0.22
0.27
b1
0.007
0.008
0.009
0.17
0.20
0.23
C
0.004
-
0.008
0.09
-
0.20
C1
0.004
-
0.006
0.09
-
0.16
D
0.354BSC
9.00BSC
D1
0.276BSC
7.00BSC
E
0.354BSC
9.00BSC
E1
0.276BSC
7.00BSC
e
0.020BSC
0.50BSC
L
0.018
0.024
0.030
0.45
0.60
0.75
L1
0.039REF
1.00REF
y
0.003MAX
0.08MAX
Θ
0-12°
0-12°
Notes:
1. To be determined at seating plane.
2. Dimensions D1 and E 1do not include mold
protrusion. D1 and E1 are maximum plastic body
size dimensions including mold mismatch.
3. Dimensions b does not include dam bar protrusion.
Total in excess of the b dimension at maximum
material condition. Dam bar cannot be located on
the lower radius of the foot.
4. Exact shape of each corner is optional.
5. These dimensions apply to the flat section of the
lead between 0.10mm and 0.25mm from the lead
tip.
6. A1 is defined as the distance from the seating
plane to the lowest point of the package body.
7. Controlling dimension: millimeter.
8. Reference documents: JEDEC MS-026, BBC.
Final
47
Version: DM562AP-DS-F03
Nov. 09, 2007



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