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Revision 1.52

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AS1701, AS1706

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Unit

Comments

-0.3

+7

V

Any Other Pin to GND

-0.3

V

Input Current (Latchup Immunity)

-100

100

mA

JEDEC 78

Continuous Power Dissipation

362

mW

Derate 4.5mW/ºC Above +70ºC

Electro-Static Discharge (ESD)

1

kV

HBM MIL-Std883E 3015.7 Methods

+85

ºC

Storage Temperature Range

-65

+150

ºC

Soldering Conditions

+260

ºC

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-

020C “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.