www.austriamicrosystems.com

Revision 1.78

12 - 15

AS1741

10 Package Drawings and Markings

The devices are available in an 8-pin MSOP package and an 8-pin SOT23 package.

Figure 18. 8-pin MSOP Package

Notes:

1. All dimensions are in millimeters, angles in degrees, unless otherwise specified.

2. Datums B and C to be determined at datum plane H.

3. Dimensions D and E1 are to be determined at datum plane H.

4. Dimensions D2 and E2 are for top package; dimensions D and E1 are for bottom package.

5. Cross section A-A to be determined at 0.13 to 0.25mm from lead tip.

6. Dimensions D and D2 do not include mold flash, protrusion, or gate burrs.

7. Dimensions E1 and E2 do not include interlead flash or protrusion.

Symbol

Typ

±Tol

Symbol

Typ

±Tol

A

1.10

Max

b

0.33

+0.07/-0.08

A1

0.10

±0.05

b1

0.30

±0.05

A2

0.86

±0.08

c

0.18

±0.05

D

3.00

±0.10

c1

0.15

+0.03/-0.02

D2

2.95

±0.10

θ1

3.0º

±3.0º

E

4.90

±0.15

θ2

12.0º

±3º

E1

3.00

±0.10

θ3

12.0º

±3º

E2

2.95

±0.10

L

0.55

±0.15

E3

0.51

±0.13

L1

0.95BSC

-

E4

0.51

±0.13

aaa

0.10

-

R

0.15

+0.15/-0.08

bbb

0.08

-

R1

0.15

+0.15/-0.08

ccc

0.25

-

t1

0.31

±0.08

e

0.65 BSC

-

t2

0.41

±0.08

S

0.525 BSC

-