CHENG- YI

CHENG- YI

ELECTRONIC

VOLTAGE RANGE

-50 TO 800 VOLTS

CURRENT

-2.0 Amperes

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

0

Ratings at 25 C ambient temperature unless otherwise specified.

Single phase, half wave, 60 Hz, reistive or inductive load.

For capacitive load, derate current by 20%.

SYMBOLS

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Voltage

Maximum DC Blocking Voltage

UNITS

V

V

V

FR2A

50

35

50

FR2B

100

70

100

FR2D

200

140

200

FR2G

400

280

400

Maximum Average Forward Rectified Current,

0

A

2.0

Peak Forward Surge Current

8.3 ms single half sine-wave superimposed

on rated load (JEDEC Method)

A

50.0

FR2J

600

420

600

FR2K

800

560

800

2

3. 8.0mm (.013mm thick) land areas.

J

Operating and Storage Temperature Range

-50 to +150

Maximum Thermal Resistance (Note 3)

20.0

RJL

Typical Junction Capacitance (Note 2)

0

V

F

Maximum Instantaneous Forward Voltage at 2.0A

0

T

Maximum DC Reverse Current

@

=25 C

A

0

T

at Rated DC Blocking Voltage

@

=125 C

A

A

nS

V

5.0

200

150

250

500

1.30

40

pF

SURFACE MOUNT ULTRAFAST

RECTIFIER

SURFACE MOUNT ULTRAFAST

RECTIFIER

.002(.051)

.008(.203)

.006(.152)

.012(.305)

.200(5.08)

.220(5.59)

.083(2.13)

.096(2.44)

.030(0.76)

.050(1.27)

.160(4.06)

.185(4.70)

.130(3.30)

.155(3.94)

.075(1.91)

.083(2.11)

SMB/DO-214AA

FR2A thru FR2K

Dimensions in inches and (millimeters)

FEATURES

For surface mounted applications

Low profile package

Built-in strain relief

Easy pick and place

Fast recovery times for high efficiency

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O

Glass passivated chip junction

High temperature soldering

o

260 C/10 seconds at terminals

MECHANICAL DATA

Case: JEDEC DO-214AA molded plastic

Terminals: Solder plated, solderable per

MIL-STD-750, Method 2026

Polarity: Indicated by cathode band

Standard Packaging: 12mm tape (EIA-481)

Weight: 0.003 ounces, 0.093 gram