CHX2090RBF

Ref. : DSCHX2090RBF2057 -26-Feb.02

1/6

Specifications subject to change without notice

United Monolithic Semiconductors S.A.S.

Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France

Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

12-24GHz Frequency Multiplier

GaAs Monolithic Microwave IC in SMD leadless package

Description

The monolithic microwave IC (MMIC) in the

package is a cascadable by 2 frequency

multiplier. It is designed for a wide range of

applications, from military to commercial

communication

systems.

The

circuit

is

manufactured with a PM-HEMT process,

0.25µm gate length, via holes through the

substrate, air bridges and electron beam

gate lithography.

It is supplied in a new SMT leadless chip

carrier.

Main Features

■ Rejection better than 15dBc

■ SMT leadless package

■ Dimensions: 5.08 x 5.08 x 0.97 mm

3

SMT Package Dimensions

Please note that PIN 1 is located in the lower left corner of the package (front-side view) for all SMD-type packages from United Monolithic Semiconductors. It is indicated

by a triangle on the package lid. Starting with PIN 1 the other pads are numbered counter-clockwise (front-side view). ATTENTION: The dot on the backside of the

package (i.e. side with metallic pads) is just for fabrication purposes and does NOT indicate the location of PIN 1.