BAS40 / -04 / -05 / -06

Small Signal Diode

Surface device type mounting

Moisture sensitivity level 1

Matte Tin(Sn) lead finish with Nickel(Ni) underplate

Pb free version and RoHS compliant

Min

Max

Min

Max

Case : Flat lead SOT 23 small outline plastic package

2.80

3.00

0.110

0.118

1.20

1.40

0.047

0.055

0.30

0.50

0.012

0.020

1.80

2.00

0.071

0.079

2.25

2.55

0.089

0.100

0.90

1.20

0.035

0.043

Maximum Ratings

Electrical Characteristics

10μA

1mA

10mA

40mA

Reverse Leakage Current

30V

Junction Capacitance

Notes:1. Test Condition : 8.3ms Single half Sine-Wave Superimposed on Rated Load (JEDEC Method)

Notes:2. Valid provided that electrodes are kept at ambient temperature

ns

Dimensions

A

Unit (inch)

0.022 REF

0.550 REF

0.38

0.2

-

-

Trr

5.0

-

Symbol

pF

f=1.0MHz

μA

-

1.00

Reverse Breakdown Voltage

Type Number

mA

Mean Forward Current

mA

200

357

40

-

Units

5

mW

40

200

Max

Min

200

40

-65 to + 125

Symbol

Type Number

Repetitive Peak Forward Current

Reverse Voltage

Repetitive Peak Reverse Voltage

Junction and Storage Temperature Range

Thermal Resistance (Junction to Ambient)

(Note 2)

RθJA

Features

Mechanical Data

Green compound (Halogen free) with suffix "G" on

packing code and prefix "G" on date code

High temperature soldering guaranteed: 260°C/10s

Terminal: Matte tin plated, lead free., solderable

per MIL-STD-202, Method 208 guaranteed

Metal-on-silicon Shcottky Barrier

Weight : 0.008gram (approximately)

G

B

C

Unit (mm)

D

E

F

Forward Voltage

Rating at 25°C ambient temperature unless otherwise specified.

Power Dissipation

-V

Units

-

0.50

Non-Repetitive Peak Forward Surge Current (Note 1)

V

Maximum Ratings and Electrical Characteristics

Value

°C

V

V

°C/W

0.6

A

BAS40

BAS40-06

BAS40-05

BAS40-04

B

A

C

D

G

F

E

Version : C09