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LTC3565IDDPBF Datasheet(PDF) 16 Page - Linear Technology |
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LTC3565IDDPBF Datasheet(HTML) 16 Page - Linear Technology |
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16 / 22 page ![]() LTC3565 3565fa Although a buck regulator is capable of providing the full output current in dropout, it should be noted that as the inputvoltageVINdropstowardVOUT,theloadstepcapability does decrease due to the decreasing voltage across the inductor. Applications that require large load step capabil- ity near dropout should use a different topology such as SEPIC, Zeta or single inductor, positive buck/boost. Insomeapplications,amoreseveretransientcanbecaused byswitchinginloadswithlarge(>1µF)inputcapacitors.The discharged input capacitors are effectively put in parallel with COUT, causing a rapid drop in VOUT. No regulator can deliverenoughcurrenttopreventthisproblem,iftheswitch connectingtheloadhaslowresistanceandisdrivenquickly. The solution is to limit the turn-on speed of the load switch driver. A Hot Swap™ controller is designed specifically for this purpose and usually incorporates current limiting, short-circuit protection, and soft-starting. Efficiency Considerations The percent efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is limiting the efficiency and which change would produce the most improvement. Percent efficiency can be expressed as: %Efficiency = 100% – (L1 + L2 + L3 + ...) where L1, L2, etc. are the individual losses as a percent- age of input power. Although all dissipative elements in the circuit produce losses, four main sources usually account for most of the losses in LTC3565 circuits: 1) LTC3565 VIN current, 2) switching losses, 3) I2R losses, 4) other losses. 1) The VIN current is the DC supply current given in the electrical characteristics which excludes MOSFET driver andcontrolcurrents.VINcurrentresultsinasmall(<0.1%) loss that increases with VIN, even at no load. 2) The switching current is the sum of the MOSFET driver and control currents. The MOSFET driver current results fromswitchingthegatecapacitanceofthepowerMOSFETs. Each time a MOSFET gate is switched from low to high to low again, a packet of charge dQ moves from VIN to ground. The resulting dQ/dt is a current out of VIN that is typically much larger than the DC bias current. In continu- ous mode, IGATECHG = fO(QT + QB), where QT and QB are the gate charges of the internal top and bottom MOSFET switches. The gate charge losses are proportional to VIN and thus their effects will be more pronounced at higher supply voltages. 3) I2R losses are calculated from the DC resistances of the internal switches, RSW, and external inductor, RL. In continuous mode, the average output current flowing through inductor L is “chopped” between the internal top and bottom switches. Thus, the series resistance look- ing into the SW pin is a function of both top and bottom MOSFET RDS(ON) and the duty cycle (DC) as follows: RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC) The RDS(ON) for both the top and bottom MOSFETs can be obtained from the Typical Performance Characteristics curves. Thus, to obtain I2R losses: I2R losses = IOUT2(RSW + RL) 4) Other “hidden” losses such as copper trace and internal battery resistances can account for additional efficiency degradations in portable systems. It is very important to include these “system” level losses in the design of a system. The internal battery and fuse resistance losses can be minimized by making sure that CIN has adequate charge storage and very low ESR at the switching frequency. Other applications inForMation Figure 3. Power Loss vs Load Currrent LOAD CURRENT (mA) VOUT = 1.2V VOUT = 1.5V VOUT = 1.8V 0.0001 0.001 1 0.1 1 10 100 1000 10000 3565 F05 0.01 0.1 VIN = 3.6V fO = 1MHz VOUT = 1.2V - 1.8V |
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