B

C

D E

F

0.001

0.01

0.1

1

10

100

0.1

1

10

100

Fault current (A)

A

Surface Mount PPTC

FSMD1210 Series

THERMAL DERATING CURVE

PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS

TYPICAL TIME-TO-TRIP AT 23°C

The dimension in the table below provide the recommended pad layout for each FSMD1210 device

Solder Reflow

Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.

1. Recommended reflow methods; IR, vapor phase oven, hot air oven.

2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)

3. Recommended maximum paste thickness is 0.25mm.

4. Devices can be cleaned by using standard industry methods and solvents.

5. Storage Environment: <30°C / 60%RH

Caution:

If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.

Rework:

Use standard industry practices.

NOTE: All Specification subject to change without notice.

A=

B=

C=

D=

E=

F=

FSMD005-1210

FSMD010-

FSMD020-

FSMD035-

FSMD050-

FSMD075-

1210

1210

1210

1210

1210

SOLDER REFLOW

2.80

1.0

1.0

2.0

Thermal Derating Curv e, FSMD1210 Serie s

0%

50%

100%

150%

200%

-40

-20

0

20

40

60

80

Ambient Temperature (C)

NOMINAL PAD DIMENSIONS (MILLIMETERS)

RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com

RoHS

ü

260 °C

217 °C

200 °C

150 °C

25 °C

f

60 to 180 Seconds

60 to 150 Seconds

Ramp-up

3°C/Second Max

20 to 40 Seconds

Ramp-down

6°C/Second Max

Preheat

C5ED03

REV 2007.8.14