Surface Mount PPTC

FSMD 1812 Series

THERMAL PRODUCT DIMENSIONS (MILLIMETERS)

PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS

The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device

SOLDER RELOW

A= FSMD 075, 110, 110-16, 125, 150

160 & 200

B= FSMD 014, 020, 035 & 050

Thermal Derating Curve, FSMD Series

0%

50%

100%

150%

200%

-40

-20

0

20

40

60

80

Ambient Temperature (C)

A

B

TYPICAL TIME-TO-TRIP AT 23°C

NOMINAL PAD DIMENSIONS (MILLIMETERS)

3.5

1.78

1.78

3.45

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Solder Reflow

Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.

1. Recommended reflow methods; IR, vapor phase oven, hot air oven.

2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)

3. Recommended maximum paste thickness is 0.25mm.

4. Devices can be cleaned by using standard industry methods and solvents.

5. Storage Environment: <30°C / 60%RH

Caution:

If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.

Rework:

Use standard industry practices.

A = FSMD014

B = FSMD020

C = FSMD035

D = FSMD050

E = FSMD075

F = FSMD110/110-16

G = FSMD125

H = FSMD150

I = FSMD160

J

FSMD200

0.001

0.01

0.1

1

10

100

0.1

1

10

100

Fault current (A)

A B

C

D E FGH I J

260 °C

217 °C

200 °C

150 °C

25 °C

f

60 to 180 Seconds

60 to 150 Seconds

Ramp-up

3°C/Second Max

20 to 40 Seconds

Ramp-down

6°C/Second Max

Preheat

C5ED04

REV 2007.8.14