Bristol, PA 19007-6810 USA

TEL (215) 781-9956 • FAX (215) 781-9845

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FEATURES

• Convert surface mount QFP packages to a 15x15 PGA footprint

• Reduce costs by using less expensive QFP packages to replace PGA footprints in

existing designs

• Pins are mechanically fastened and soldered to board using Aries’ patented process,

creating a reliable electrical connection and rugged contact

• Consult factory for panelized form or for mounting of consigned chips

GENERAL SPECIFICATIONS

• ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces

• PADS: bare Cu protected with ENIG or immersion white Sn to eliminate copla-

narity concerns and solder bridges associated with hot air solder leveling

• PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00

• PIN PLATING: 200μ [5.08μ] min. Sn per ASTM B 545 Type 1 or Sn/Pb 93/7 per

ASTM B 545 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290

• OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

• SUGGESTED PCB HOLE SIZE: 0.062 ±0.003 [1.58 ±0.08] dia.

• Will plug into standard PGA sockets

18025

Rev. AA

P/N 97-68340 for Motorola 68340

144-Pin QFP-to-PGA Adapter

ORDERING INFORMATION

P/N 97-68340

P/N 97-68340-P for Panelized Form

P/N 145-PGM15024-30 for Wire Wrap PGA

Socket

CUSTOMIZATION: In addition to the standard products shown

on this page, Aries specializes in custom design and production.

Special materials, platings, sizes, and configurations can be

furnished, depending on the quantity.

NOTE: Aries reserves the

right to change product general specifications without notice.

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

ROW-TO-ROW ±0.003 [±0.08]

PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS