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BA7664AFV Datasheet(PDF) 3 Page - Rohm |
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BA7664AFV Datasheet(HTML) 3 Page - Rohm |
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3 / 5 page ![]() BA7664AFV Technical Note 3/4 www.rohm.com 2009.04 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. ● Equivalent circuit Pin.No Pin name IN OUT Voltage Equivalent circuit Function 1 5 MUTEA MUTEB ○ ― ― Mute control terminal Pin1 MUTEA - “H” = mute on Pin5 MUTEB - “H” = only chroma mute on 2 YIN ○ ― 2.0V Signal input terminal Sync-tip-clamp input for the composite Y signal. 3 GND ― ― 0V Ground terminal 4 CIN ○ ― 2.0V Signal input terminal This pin is a chroma signal input. Input terminal is 20kΩ. 6 7 MIXOUT2 MIXOUT1 ― ○ 0.9V 0.95V Signal output terminal Pin7 is Y/C MIX signal output terminal. Power save mode is active when output is set under 0.2V. Pin6 is a sag compensator input. 8 VCC ― ― 5.0V Power supply terminal ● Cautions on use 1. Numbers and data in entries are representative design values and are not guaranteed values of the items. 2. Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to verify circuit characteristics for your particular application. Modification of constants for other externally connected circuits may cause variations in both static and transient characteristics for external components as well as this ROHM IC. Allow for sufficient margins when determining circuit constants. 3. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings, such as the applied voltage or operating temperature range (Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using the IC at times where the absolute maximum ratings may be exceeded. 4. GND potential Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at any time, regardless of whether it is a transient signal or not. 5. Thermal design Perform thermal design, in which there are adequate margins, by taking into account the permissible dissipation (Pd) in actual states of use. 6. Short circuit between terminals and erroneous mounting Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other components on the circuits, can damage the IC. 7. Operation in strong electromagnetic field Using the ICs in a strong electromagnetic field can cause operation malfunction. 15k 14k GND 20k VCC Pin7 Pin6 |
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