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LM2991QML Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # LM2991QML
Description  Negative Low Dropout Adjustable Regulator
PDF  13 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2991QML Datasheet(HTML) 5 Page - National Semiconductor (TI)

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LM2991 Electrical Characteristics (Continued)
DC Drift Parameters
The following conditions apply, unless otherwise specified.
DC:
V
I = −10V, VO = −3V, IO = 1A, CO = 47µF, RL = 2.7K
Ω Deltas not required on B−Level product. Deltas required for
S−Level product ONLY.
Symbol
Parameter
Conditions
Notes
Min
Max
Units
Sub-
groups
V
Ref
Reference Voltage
5mA
≤ I
O
≤ 1A
±20
mV
1
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction
to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax =(TJmax -TA)/θJA or the
number given in the Absolute Maximum Ratings, whichever is lower.
Note 3: The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this
improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the
printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using
θJA, rather than θJC, thermal resistance. It must not be
assumed that the device leads will provide substantial heat transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to
the material of the package base. The stated
θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance
between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the
stated value for the package, to calculate the total allowed power dissipation for the device. The user must determine the value of the additional thermal resistance
and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.
Note 4: Human body model, 1.5 k
Ω in series with 100 pF.
www.national.com
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