SS6383BCSTR datasheet(3/8 Pages) SSC

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SS6383B(G)

11/07/2004 Rev.2.01

TEST CIRCUIT

VIN

GND

VCNTL

VOUT

VREF

SS6383

2.5

3.3

1.25V

COUT

µF

VOUT

ELECTRICAL CHARACTERISTICS

(VCNTL=3.3V, VIN=2.5V, VREF=0.5VIN, COUT=10µF, TA=25°C, unless otherwise specified)

PARAMETER

TEST CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

VIN

1.6

2.5

Input Voltage (DDR1/2)

Keep VCNTL≥VIN during

power on and off sequences

VCNTL

3.0

3.3

Output Voltage

IOUT = 0mA

VOUT

VREF

Output Voltage Offset

IOUT = 0mA

VOS

-20

IOUT =0.1mA ~ +3A

Load Regulation (DDR1/2)

IOUT =0.1mA ~ -3A

∆VLOR

Quiescent Current

VREF<0.2V, VOUT = OFF

µA

Operating Current of VCNTL No load

ICNTL

VREF Bias Current

VREF=1.25V

µA

Current Limit

IIL

3.2

6.5

THERMAL PROTECTION

Thermal Shutdown

Temperature

3.3V

≤VCNTL≤5V

TSD

125

150

°C

Thermal Shutdown

Hysteresis

Guaranteed by design

°C

SHUTDOWN SPECIFICATIONS

Output ON (VREF=0V 1.25V)

0.8

Shutdown Threshold

Output OFF (VREF=1.25V 0V)

0.2

Note 2: VOS is the voltage measurement, which is defined as the difference between VOUT and VREF.

Note 3: Load regulation is measured at constant junction temperature, using pulse testing with a low ON time.

Note 4: Current limit is measured by pulsing a short time.

Note 5: To operate the system safely; VCNTL must be always greater than VIN.

Note 6: Specifications are guaranteed by Statistical Quality Controls (SQC), and not production tested,

within the operating temperature range of -40

°C to 85°C.

Note 7: DDR2 is not supported in the TO-263 package.

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