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AM1806 Datasheet(PDF) 107 Page - Texas Instruments

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Part # AM1806
Description  AM1806 ARM Microprocessor
PDF  241 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AM1806 Datasheet(HTML) 107 Page - Texas Instruments

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background image
A1
A1
X
Y
OFFSET
RecommendedDDR2/mDDR
DeviceOrientation
Y
Y
OFFSET
DDR2/mDDR
Device
AM1806
www.ti.com
SPRS658B – FEBRUARY 2010 – REVISED MAY 2010
6.11.3.4 Placement
Figure 6-17 shows the required placement for the device as well as the DDR2/mDDR devices. The
dimensions for Figure 6-18 are defined in Table 6-28. The placement does not restrict the side of the PCB
that the devices are mounted on. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space. For single-memory DDR2/mDDR systems, the second
DDR2/mDDR device is omitted from the placement.
Figure 6-18. Device and DDR2/mDDR Device Placement
Table 6-28. Placement Specifications
No.
Parameter
Min
Max
Unit
Notes
1
X
1750
Mils
See Notes (1), (2)
2
Y
1280
Mils
See Notes (1), (2)
3
Y Offset
650
Mils
See Notes (1). (2), (3)
4
Clearance from non-DDR2/mDDR signal to DDR2/mDDR Keepout Region
4
w (4) See Note (5)
(1)
See Figure 6-18 for dimension definitions.
(2)
Measurements from center of device to center of DDR2/mDDR device.
(3)
For single memory systems it is recommended that Y Offset be as small as possible.
(4)
w = PCB trace width as defined in Table 6-27 .
(5)
Non-DDR2/mDDR signals allowed within DDR2/mDDR keepout region provided they are separated from DDR2/mDDR routing layers by
a ground plane.
Copyright © 2010, Texas Instruments Incorporated
Peripheral Information and Electrical Specifications
107
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Product Folder Link(s): AM1806



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