BAV756S_BAW56_SER_5

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 05 — 26 November 2007

11 of 15

NXP Semiconductors

BAV756S; BAW56 series

High-speed switching diodes

Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88)

Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88)

sot363

1.20

2.40

0.50

(4

×)

0.40

(2

×) 0.90 2.10

0.50

(4

×)

0.60

(2

×)

2.35

2.65

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

solder lands

solder resist

occupied area

1.15

3.75

transport direction during soldering

1.00

0.30

4.00

4.50

5.25

sot363

Dimensions in mm