BCP51 datasheet(6/15 Pages) NXP

6 / 15 page

BC636_BCP51_BCX51_8

Product data sheet

Rev. 08 — 22 February 2008

6 of 15

NXP Semiconductors

BC636; BCP51; BCX51

45 V, 1 A PNP medium power transistors

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from

junction to ambient

in free air

BC636

[1] -

150

K/W

BCP51

[1] -

190

K/W

[2] -

125

K/W

BCX51

[1] -

230

K/W

[2] -

135

K/W

[3] --95

K/W

Rth(j-sp)

thermal resistance from

junction to solder point

BC636

K/W

BCP51

K/W

BCX51

K/W

FR4 PCB, standard footprint

Fig 4.

Transient thermal impedance from junction to ambient as a function of pulse duration for SOT54;

typical values

006aaa222

102

103

Zth(j-a)

(K/W)

10−1

10−5

10−2

10−4

102

10−1

tp (s)

10−3

103

duty cycle =

0.75

0.5

0.33

0.2

0.1

0.05

0.02

0.01

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