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BCP52 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BCP52 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() BCP52_BCX52_8 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 08 — 25 February 2008 3 of 12 NXP Semiconductors BCP52; BCX52 60 V, 1 A PNP medium power transistors 5. Limiting values [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - −60 V VCEO collector-emitter voltage open base - −60 V VEBO emitter-base voltage open collector - −5V IC collector current - −1A ICM peak collector current single pulse; tp ≤ 1ms - −1.5 A IBM peak base current single pulse; tp ≤ 1ms - −0.2 A Ptot total power dissipation Tamb ≤ 25 °C BCP52 [1] - 0.65 W [2] -1 W BCX52 [1] - 0.5 W [2] - 0.9 W [3] - 1.3 W Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C |
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