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LY530AL Datasheet(PDF) 28 Page - STMicroelectronics |
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LY530AL Datasheet(HTML) 28 Page - STMicroelectronics |
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28 / 30 page ![]() Package information LY530AL 28/30 7 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK® is an ST trademark. ECOPACK® specifications are available at: www.st.com. Figure 12. LGA-16: mechanical data and package dimensions A1 1.46 1.5 1.6 0.057 0.059 0.063 A2 1.33 0.052 A3 0.16 0.2 0.24 0.006 0.008 0.009 C0.3 0.012 D1 4.85 5 5.15 0.191 0.197 0.203 E1 4.85 5 5.15 0.191 0.197 0.203 L0.8 0.031 L1 3.2 0.126 M 1.6 0.062 M1 2.15 2.175 2.20 0.0850.0860.087 M2 1.625 0.064 N 2.175 0.086 N1 2.4 0.094 T1 0.8 0.031 T2 0.475 0.5 0.525 0.019 0.020 0.021 R 1.2 1.6 0.047 0.063 S 0.1 0.004 h 0.15 0.006 k 0.05 0.002 j 0.1 0.004 LGA-16 (5x5x1.6mm) Land Grid Array Package 7887555A |
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