PCA9517_3

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 — 30 January 2007

13 of 19

NXP Semiconductors

PCA9517

Fig 15. Package outline SOT505-1 (TSSOP8)

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.45

0.25

0.28

0.15

3.1

2.9

3.1

2.9

0.65

5.1

4.7

0.70

0.35

6

°

0

°

0.1

0.1

0.1

0.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.4

SOT505-1

99-04-09

03-02-18

bp

D

Z

e

0.25

14

8

5

θ

A

A2

A1

Lp

(A3)

detail X

L

HE

E

c

X

A

y

2.5

5 mm

0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm

SOT505-1

1.1

pin 1 index