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PCA9540BDP Datasheet(PDF) 22 Page - NXP Semiconductors |
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PCA9540BDP Datasheet(HTML) 22 Page - NXP Semiconductors |
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22 / 22 page ![]() NXP Semiconductors PCA9540B 2-channel I2C-bus multiplexer © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 September 2009 Document identifier: PCA9540B_4 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Device addressing . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Control register . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2.1 Control register definition . . . . . . . . . . . . . . . . . 4 6.3 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.4 Voltage translation . . . . . . . . . . . . . . . . . . . . . . 5 7 Characteristics of the I2C-bus. . . . . . . . . . . . . . 6 7.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.2 START and STOP conditions . . . . . . . . . . . . . . 6 7.3 System configuration . . . . . . . . . . . . . . . . . . . . 7 7.4 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.5 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Application design-in information . . . . . . . . . . 8 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 10 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 12 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 13 Soldering of SMD packages . . . . . . . . . . . . . . 17 13.1 Introduction to soldering . . . . . . . . . . . . . . . . . 17 13.2 Wave and reflow soldering . . . . . . . . . . . . . . . 17 13.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17 13.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21 16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 16.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 17 Contact information. . . . . . . . . . . . . . . . . . . . . 21 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 |
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