PCA9670_2

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 02 — 17 July 2007

21 of 28

NXP Semiconductors

PCA9670

Fig 23. Package outline SOT162-1 (SO16)

UNIT

A

max.

cD

(1)

E

(1)

(1)

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

2.65

0.3

0.1

2.45

2.25

0.49

0.36

0.32

0.23

10.5

10.1

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT162-1

8

16

D

detail X

Z

e

9

1

y

0.25

075E03

MS-013

pin 1 index

0.1

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.41

0.40

0.30

0.29

0.05

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

X

θ

A

Q

E

c

L

(A )

3

A

0

5

10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

99-12-27

03-02-19