126

RoHS Compliant, ELV Compliant

10

Test

Conditions

Resistance Change

Passive aging

70°C, 1000 hours

±5%

85°C, 1000 hours

±5%

Humidity aging

85°C, 85%RH, 1000 hours

±5%

Thermal shock

85°C, -40°C (10 times)

±5%

Solvent resistance

MIL-STD-202, Method 215F

No change

Lead material

Soldering characteristics

Solderability per ANSI/J-STD-002 Category 3

Solder heat withstand

per IEC-STD 68-2-20, Test Tb, Method 1A, Condition B, can withstand 10 seconds at 260°C ±5°C

Insulating material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Operation temperature

-40°C~85°C

Note: Devices are not designed to be placed through a reflow process.

BBRF

Physical Characteristics

Environmental Specifications

Test

Conditions

Resistance Change

Passive aging

-40°C, 1000 hours

±5%

85°C, 1000 hours

±5%

Humidity aging

85°C, 85%RH, 1000 hours

±10%

Thermal shock

85°C, -40°C (10 times)

±10%

Solvent resistance

MIL-STD-202, Method 215F

No change

Lead material

RXEF005

RXEF010

Soldering characteristics

Solderability per ANSI/J-STD-002 Category 3

RXEF005, RXEF010 meet ANSI/J-STD-002 Category 1

Solder heat withstand

RXEF017- RXEF025: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;

can withstand 5 seconds at 260°C ±5°C

All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b;

can withstand 10 seconds at 260°C ±5°C

Insulating material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Operation temperature

-40°C~85°C

Note: Devices are not designed to be placed through a reflow process.

RXEF

Physical Characteristics

Environmental Specifications

Lead material

Soldering characteristics

Solderability per ANSI/J-STD-002 Category 3

Solder heat withstand

RKEF050-RKEF185 : per IEC-STD 68-2-20, Test Tb, Method 1a, condition a;

can withstand 5 seconds at 260°C ±5°C

All other sizes: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b;

RKEF can withstand 10 seconds at 260°C ±5°C

Insulating material

Cured, flame-retardant epoxy polymer; meets UL 94V-0

Operation temperature

-40°C~85°C

Note: Devices are not designed to be placed through a reflow process.

RKEF

Physical Characteristics

Table R5 Physical Characteristics and Environmental Specifications for Radial-leaded Devices