MAX15059 datasheet(2/15 Pages) MAXIM

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76V, 300mW Boost Converter and Current

Monitor for APD Bias Applications

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

IN, SHDN, FB, ILIM, RLIM, CNTRL to SGND..........-0.3V to +6V

LX to PGND...........................................................-0.3V to +80V

BIAS to SGND ......................................................-0.3V to +79V

APD, CLAMP to SGND........................... -0.3V to (VBIAS + 0.3V)

PGND to SGND....................................................-0.3V to +0.3V

MOUT to SGND.................................. -0.3V to (VCLAMP + 0.3V)

Continuous Power Dissipation (TA = +70NC)

16-Pin TQFN-EP (derate 20.8mW/NC

above +70NC) .........................................................1666.7mW

Junction-to-Case Thermal Resistance (BJC) (Note 1)

16-Pin TQFN-EP ......................................................... +7NC/W

Junction-to-Ambient Thermal Resistance (BJA) (Note 1)

16-Pin TQFN-EP ....................................................... +48NC/W

Operating Temperature Range.......................... -40NC to +85NC

Maximum Junction Temperature.....................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(VIN = VSHDN = VCNTRL = 3.3V, CIN = 1FF, VPGND = VSGND = 0V, VBIAS = 40V, LX = APD = CLAMP = ILIM = unconnected, VMOUT

VRLIM = 0V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

INPUT SUPPLY

Supply Voltage Range

VIN

2.8

5.5

Supply Current

ISUPPLY

VFB = 1.4V, no switching

1.2

Undervoltage-Lockout Threshold

VUVLO

VIN rising

2.475

2.6

2.775

Undervoltage-Lockout Hysteresis VUVLO_HYS

200

Shutdown Current

ISHDN

VSHDN = 0V

Shutdown BIAS Current

IBIAS_SHDN VBIAS = 3.3V, VSHDN = 0V

BOOST CONVERTER

Output-Voltage Adjustment

Range

VIN + 5

Switching Frequency

fSW

VIN = 5V

380

400

420

kHz

Maximum Duty Cycle

DCLK

VIN = 2.8V

FB Set-Point Voltage

VFB_SET

1.2054

1.23

1.2546

FB Input-Bias Current

IFB

VFB = VFB_SET, TA = +25NC

500

Internal Switch On-Resistance

RON

ILX = 100mA, VIN = 2.8V

Peak Switch Current Limit

ILIM_LX

MAX15059A

1.1

1.2

1.3

MAX15059B

0.825

0.9

0.975

Peak Current-Limit Response

100

LX Leakage Current

VLX = 76V, TA = +25NC

Line Regulation

2.8V P VIN P 5.5V, ILOAD = 4.5mA

0.2

Load Regulation

0 P ILOAD P 4.5mA

Soft-Start Duration

Soft-Start Steps

Steps

CONTROL INPUT (CNTRL)

Maximum Control Input Voltage

Range

FB set point is controlled to VCNTRL

1.2

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