OPA330 datasheet(11/29 Pages) TI

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OPA330

1MW

60kW

100kW

1MW

NTC

Thermistor

IN+

OUT

V +

YFFPACKAGE

WCSP-5

(TOPVIEW)

(Bumpsidedown;

nottoscale)

ActualSize:

ExactSize(max):

0,862mmx1,156mm

YFFPACKAGE

WCSP-5EnlargedImage

(TopView)

(Bumpsidedown)

PackageMarkingCode:

YMD=year/month/day

TBD=indicatesOPA330AIYFF

S=forengineeringpurposesonly

OPA330

OPA2330

OPA4330

www.ti.com

SBOS432D – AUGUST 2008 – REVISED JUNE 2010

RN are operational resistors used to isolate the

Following these guidelines reduces the likelihood of

ADS1100 from the noise of the digital I2C bus.

junctions being at different temperatures, which can

Because the ADS1100 is a 16-bit converter, a precise

cause thermoelectric voltages of 0.1mV/°C or higher,

reference is essential for maximum accuracy. If

depending on materials used.

absolute accuracy is not required, and the 5V power

supply is sufficiently stable, the REF3130 may be

OPA330 WCSP

omitted.

The OPA330 YFF package is a lead- (Pb-) free,

Figure 23 shows the OPA330 in a typical thermistor

die-level, wafer chip-scale package (WCSP). Unlike

circuit.

devices that are in plastic packages, these devices

have no molding compound, lead frame, wire bonds,

or leads. Using standard surface-mount assembly

procedures, the WCSP can be mounted to a printed

circuit

board

(PCB)

without

additional

underfill.

Figure 24 and Figure 25 detail the pinout and

package marking, respectively. See the NanoStar™

and

NanoFree™

300mm

Solder

Bump

WCSP

Application

Note

(SBVA017)

for

detailed

information on package characteristics and PCB

design.

Figure 23. Thermistor Measurement

GENERAL LAYOUT GUIDELINES

Attention

good

layout

practice

always

recommended.

Keep

traces

short

and,

when

possible, use a printed circuit board (PCB) ground

plane with surface-mount components placed as

close to the device pins as possible. Place a 0.1mF

capacitor closely across the supply pins. These

guidelines should be applied throughout the analog

circuit to improve performance and provide benefits

such as reducing the electromagnetic interference

Figure 24. WCSP Pin Description

(EMI) susceptibility.

For lowest offset voltage and precision performance,

circuit layout and mechanical conditions should be

optimized. Avoid temperature gradients that create

thermoelectric (Seebeck) effects in the thermocouple

junctions

formed

from

connecting

dissimilar

conductors. These thermally-generated potentials can

be made to cancel by assuring they are equal on

both

input

terminals.

Other

layout

and

design

considerations include:

•

Use

low

thermoelectric-coefficient

conditions

(avoid dissimilar metals).

•

Thermally

isolate

components

from

power

Figure 25. YFF Package Marking

supplies or other heat sources.

•

Shield op amp and input circuitry from air

currents, such as cooling fans.

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Product Folder Link(s): OPA330 OPA2330 OPA4330

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