See mechanical drawings for dimensions.

DBV PACKAGE

(TOP VIEW)

5

1

V

CC

A

2

B

3

4

GND

Y

DRL PACKAGE

(TOP VIEW)

2

B

V

CC

5

1

A

3

4

GND

GND

Y

DCK PACKAGE

(TOP VIEW)

2

B

3

4

GND

V

CC

5

A

Y

1

YZP PACKAGE

(BOTTOM VIEW)

2

B

V

CC

1 5

A

GND

4

3

Y

SN74LVC1G00

www.ti.com

SCES212V – APRIL 1999 – REVISED FEBRUARY 2010

SINGLE 2-INPUT POSITIVE-NAND GATE

Check for Samples: SN74LVC1G00

1

FEATURES

•

Available in the Texas Instruments NanoStar™

•

Package

Operation

•

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

Inputs Accept Voltages to 5.5 V

•

ESD Protection Exceeds JESD 22

•

–

2000-V Human-Body Model (A114-A)

•

–

1000-V Charged-Device Model (C101)

•

±24-mA Output Drive at 3.3 V

DESCRIPTION/ORDERING INFORMATION

The SN74LVC1G00 performs the Boolean function Y = A

● B or Y = A + B in positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

SN74LVC1G00YZPR

_ _ _ CA_

(Pb-free)

Reel of 3000

SN74LVC1G00DBVR

SOT (SOT-23) – DBV

C00_

–40°C to 85°C

Reel of 250

SN74LVC1G00DBVT

Reel of 3000

SN74LVC1G00DCKR

SOT (SC-70) – DCK

Reel of 250

SN74LVC1G00DCKT

CA_

SOT (SOT-553) – DRL

Reel of 4000

SN74LVC1G00DRLR

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

● = Pb-free).

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 1999–2010, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.