74HC08

http://onsemi.com

2

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

V

DC Input Voltage (Referenced to GND)

V

DC Output Voltage (Referenced to GND)

V

DC Input Current, per Pin

±20

mA

DC Output Current, per Pin

±25

mA

±50

mA

Power Dissipation in Still Air,

SOIC Package†

TSSOP Package†

500

450

mW

Storage Temperature

– 65 to + 150

_C

Lead Temperature, 1 mm from Case for 10 Seconds

SOIC or TSSOP Package

260

_C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress

ratings only. Functional operation above the Recommended Operating Conditions is not implied.

Extended exposure to stresses above the Recommended Operating Conditions may affect device

reliability.

†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage (Referenced to GND)

2.0

6.0

V

DC Input Voltage, Output Voltage (Referenced to

GND)

0

V

Operating Temperature Range, All Package Types

– 55

+ 125

_C

Input Rise/Fall Time

(Figure 1)

0

0

0

1000

500

400

ns

ORDERING INFORMATION

Device

Package

74HC08DR2G

SOIC−14

(Pb−Free)

2500/Tape & Reel

74HC08DTR2G

TSSOP−14*

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*This package is inherently Pb−Free.

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

Unused inputs must always be

tied to an appropriate logic voltage

Unused outputs must be left open.