M34E02, M34E02-F

Package mechanical data

Doc ID 10367 Rev 10

29/34

Figure 14.

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, outline

1.

Drawing is not to scale.

2.

allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering

process.

3.

The circle in the top view of the package indicates the position of pin 1.

Table 15.

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters

1.

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

A

0.550

0.450

0.600

0.0217

0.0177

0.0236

A1

0.020

0

0.050

0.0008

0

0.0020

b

0.250

0.200

0.300

0.0098

0.0079

0.0118

D

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MB)

1.600

1.500

1.700

0.0630

0.0591

0.0669

D2 (rev MC)

1.200

1.600

0.0472

0.0630

E

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MB)

0.200

0.100

0.300

0.0079

0.0039

0.0118

E2 (rev MC)

1.20

1.6

0.0472

0.0630

e

0.500

-

-

0.0197

-

-

K

-

0.300

-

-

0.0118

-

L

-

0.300

0.500

-

0.0118

0.0197

L1

-

-

0.150

-

0.0059

L3

0.300

-

-

0.0118

-

2.

Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.050

-

-

0.0020

-

-

D

E

ZW_MEd

A

A1

ddd

L1

e

b

D2

L

E2

L3

L1

e

b

D2

L

E2

L3

Pin 1

K

K

REV MB

REV MC