 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
STM6522 Datasheet(PDF) 18 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STM6522 Datasheet(HTML) 18 Page - STMicroelectronics |
|
|
18 / 25 page  Package footprint STM6522 18/25 Doc ID 17045 Rev 2 7 Package footprint Figure 14. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad Table 7. Parameters for landing pattern - TDFN – 8-lead 2 x 2 mm package Parameter Description Dimension (mm) Min. Nom. Max. L Contact length 1.05 — 1.15 b Contact width 0.25 — 0.30 E Max. land pattern Y-direction — 2.85 — E1 Contact gap spacing — 0.65 — D Max. land pattern X-direction — 1.75 — P Contact pitch — 0.5 — AM00441 D P E1 E L b |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
