A

2

4

Y

A

1

3

Y

SN74LVC1G34

ORDERING INFORMATION

TOP-SIDE

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

SN74LVC1G34YFPR

_ _ _ C9_

0.23-mm Large Bump – YFP

Reel of 3000

NanoFree™ – WCSP (DSBGA)

SN74LVC1G34YZPR

_ _ _ C9_

0.23-mm Large Bump – YZP

NanoFree™ – WCSP (DSBGA)

_ _ _ _

Reel of 3000

SN74LVC1G34YZVR

0.23-mm Large Bump – YZV (Pb-free)

C9

–40°C to 85°C

Reel of 3000

SN74LVC1G34DBVR

SOT (SOT-23) –DBV

C34_

Reel of 250

SN74LVC1G34DBVT

Reel of 3000

SN74LVC1G34DCKR

SOT (SC-70) – DCK

Reel of 250

SN74LVC1G34DCKT

C9_

SOT (SOT-553) – DRL

Reel of 4000

SN74LVC1G34DRLR

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2

has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

FUNCTION TABLE

INPUT

OUTPUT

A

Y

H

H

L

L

LOGIC DIAGRAM (POSITIVE LOGIC)

(DBV, DCK, DRL, and YZP Package)

LOGIC DIAGRAM (POSITIVE LOGIC)

(YFP and YZV Package)

2

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