bq24090, bq24091

bq24092, bq24093

SLUS968B – JANUARY 2010 – REVISED JUNE 2010

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

DESCRIPTION CONTINUED

The charger power stage and charge current sense functions are fully integrated. The charger function has high

accuracy current and voltage regulation loops, charge status display, and charge termination. The pre-charge

current and termination current threshold are programmed via an external resistor. The fast charge current value

is also programmable via an external resistor.

ORDERING INFORMATION

PART #

JEITA

TS/CE

PG

PACKAGE

Marking

bq24090

4.20 V

6.6 V

No

10k

Ω NTC

Yes

bq24090

bq24091

4.20 V

6.6 V

No

100k

Ω NTC

Yes

bq24091

bq24092

4.20 V

6.6 V

Yes

10k

Ω NTC

Yes

bq24092

bq24093

4.20 V

6.6 V

Yes

100k

Ω NTC

Yes

bq24093

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

IN (with respect to VSS)

–0.3 to 7

V

OUT (with respect to VSS)

–0.3 to 7

V

Input Voltage

PRE-TERM, ISET, ISET2, TS, CHG, PG, ASI, ASO (with respect to

–0.3 to 7

V

VSS)

Input Current

IN

1.25

A

Output Current (Continuous)

OUT

1.25

A

Output Sink Current

CHG

15

mA

Junction temperature

–40 to 150

°C

Storage temperature

–65 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground terminal unless otherwise noted.

PACKAGE DISSIPATION RATINGS

(1) (2)

PACKAGE

DERATING FACTOR

POWER RATING

5x3mm MSOP

52°C/W

48°C/W

1.92 W

19.2 mW/°C

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

This data is based on using the JEDEC High-K board and the exposed die pad is connected to a copper pad on the board. This is

connected to the ground plane by a 2×3 via matrix

2

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