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SN65LVELT22 Datasheet(PDF) 3 Page - Texas Instruments

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Part # SN65LVELT22
Description  3.3 V Dual LVTTL to DIfferential LVPECL Translator
PDF  11 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN65LVELT22 Datasheet(HTML) 3 Page - Texas Instruments

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PECL DC CHARACTERISTICS
(1) (V
CC = 3.3 V, GND = 0.0 V
(2)
TTL DC CHARACTERISTICS
(1) (V
CC = 3.3 V; TA = –40°C to 85°C)
AC CHARACTERISTICS
(1)(V
CC = 3.3 V; GND = 0.0 V)
SN65LVELT22
www.ti.com............................................................................................................................................................................................ SLLS928 – DECEMBER 2008
–40°C
25°C
85°C
CHARACTERISTICS
UNIT
MIN
TYP
MAX
MIN
TYP MAX
MIN
TYP MAX
ICC
Power Supply Current
23
33
25
33
26
33
mA
VOH
Output HIGH Voltage (3)
2275 2317
2420 2275 2331 2420 2275 2343 2420
mV
VOL
Output LOW Voltage(3)
1490 1558
1680 1490 1556 1680 1490 1555 1680
mV
(1)
Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
(2)
Input parameters vary 1:1 with VCC. VCC can vary ±0.15 V
(3)
Outputs are terminated through a 50-
Ω resistor to VCC – 2.0 V.
CHARACTERISTIC
CONDITION
MIN
TYP
MAX
UNIT
IIH
Input HIGH current
VIN = 2.7 V
20
µA
IIHH
Input HIGH current max
VIN = VCC
100
µA
IIL
Input LOW current
VIN = 0.5 V
–0.2
mA
VIK
Input clamp diode voltage
IIN = –18 mA
–1.2
V
VIH
Input HIGH voltage
2.0
V
VIL
Input LOW voltage
0.8
V
(1)
Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
–40°C
25°C
85°C
CHARACTERISTIC
UNIT
MIN
TYP MAX
MIN
TYP
MAX
MIN
TYP
MAX
fMAX
Max switching frequency(2), see Figure 5
1750
1750
1700
MHz
tPLH/tPHL
Propagation delay to output at 1.5V, see
200
425
550
200
445
550
200
460
550
ps
Figure 4
Within – device skew(3)
20
50
20
50
20
50
tSKEW
ps
Device-to-device skew(4)
30
100
30
100
30
100
tJITTER
Random clock jitter (RMS)
0.5
1.0
0.5
1.0
0.5
1.0
ps
tr/tf
Output rise/fall times Q (20%–80%)
300
500
300
500
300
500
ps
(1)
Device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with
maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature
range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied
individually under normal operating conditions and not valid simultaneously.
(2)
Maximum switching frequency measured at output amplitude of 300 mVpp.
(3)
This is measured between outputs under the identical transitions and conditions on any one device.
(4)
Device-Device Skew is defined as identical transitions at identical VCC levels.
Copyright © 2008, Texas Instruments Incorporated
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