407

Motor driver ICs

BA6222

FApplication example

FOperation notes

(1)

Output voltage control pin (pin 4)

The voltage at pin 4 is related to the HIGH output voltage

put current and the chip temperature. The output voltage

is about four times the voltage at pin 4.

ing to the output state :

An oscillation may occur if a circuit having an output im-

pedance of more than a few hundred ohms is connected

to pin 4. In this case, connect a capacitor of at least

3300pF between pin 4 and GND.

(2)

Thermal shutdown circuit

The thermal shutdown circuit turns off the driver output

if the chip temperature rises to about 150

_C. The shut-

down signal is not latched.

(3)

Make sure that pin voltages will not exceed the sup-

ply voltage by more than 0.3V or will not become less

than the GND pin voltage by more than 0.3V.

(4)

The quality of these products have been carefully

checked; however, use of the products with applied volt-

ages, operating temperatures, or other parameters that

exceed the absolute maximum rating given may result in

the damage of the IC and the product it is used in. If the

IC is damaged, the short mode and open modes cannot

be specified, so if the IC is to be used in applications

where parameters may exceed the absolute maximum

ratings, then be sure to incorporate fuses, or other physi-

cal safety measures.

(5)

Input pins

Voltage should never be applied to the input pins when

electrical characteristics.

(6)

Back-rush voltage

Depending on the ambient conditions, environment, or

motor characteristics, the back-rush voltage may fluctu-

ate. Be sure to confirm that the back-rush voltage will not

adversely affect the operation of the IC.

(7)

Large current line

Large currents are carried by the motor power supply and

motor ground for these ICs.

Therefore, the layout of the pattern of the PC board and

the constants of certain parameters for external compo-

nents, such as the capacitor between the power supply

and ground, may cause this large output current to flow

back to the input pins, resulting in output oscillation or

other malfunctions. To prevent this, make sure that the

PC board layout and external circuit constants cause no

problems with the characteristics of these ICs.

(8)

Power dissipation

The power dissipation will fluctuate depending on the

mounting conditions of the IC and the ambient environ-

ment. Make sure to carefully check the thermal design of

the application where these ICs will be used.

(9)

Power consumption

The power consumption by the IC varies widely with the

power supply voltage and the output current. Give full

consideration to the power dissipation rating and the

thermal resistance data and transient thermal resistance

data, to provide a thermal design so that none of the rat-

ings for the IC are exceeded.