SC668 datasheet(23/46 Pages) SEMTECH

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SC668

Applications Information (continued)

PCB Layout Considerations

The layout diagram in Figure 16 illustrates a two-layer

PCB layout for the SC668 and supporting components.

F o l l o w i n g f u n d a m e n t a l l a y o u t r u l e s i s

critical for achieving the performance specified in the

Electrical Characteristics table. The following guidelines

are recommended when developing a PCB layout:

Place all bypass and decoupling capacitors —

IN, CLDO1, CLDO2, CLDO3, CLDO4, and CBYP as close to

the device as possible.

Ensure that all connections to pins IN and OUT

make use of wide traces so that the resistive

drop on each connection is minimized.

The thermal pad should be connected to the

ground plane using multiple vias to ensure

proper thermal connection for optimal heat

transfer.

The following capacitors — C

LDO1, CLDO2, CLDO3,

LDO4, and CBYP should be grounded together.

Connect these capacitors to the ground plane at

one point near the SC668 as shown in Figure 16.

•

Figure 17 shows the component copper layer.

Make all ground connections to a solid ground

plane as shown in Figure 18.

All LDO output traces should be made as wide

as possible to minimize resistive losses.

•

Figure 16 — Recommended PCB Layout

Figure 17 — Layer 1

Figure 18 — Layer 2

CLDO1

BL8

BL7

PWM

SDA

SCL

LDO1

BL1

VIN

SC668

GND

VIN

ADI

CBYP

GND

Ground

Plane

CIN

CLDO2

CLDO3

CLDO4

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