+ - - - - - - - - - +

Y

= Y E A R

|

|

M

= M O N T H

| Y M S N

|

S

= LOT

S E Q U E N C E

|

62

|

4TH

CHAR

= W A F E R F A B / A S S E M B L Y SITE

CODE

| O

|

LINE

2

= D E V I C E N A M E CODE

+ - - - - - - - - - - +

O

=

PIN

ONE

( FILLED

C I R C L E )

-

TPS22934

SLVSAD4 – AUGUST 2010

www.ti.com

ORDERABLE PART NUMBER

Tape and reel

TPS22934YZVR

–40°C to 85°C

DSBGA – YZP (0.5-mm pitch)

_ _ _ _ 6 2

Tape and reel

TPS22934YZVT

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

The actual top-side marking has four preceding characters to denote year, month, sequence code, and the wafer fab/assembly site. Pin

1 identifier indicates solder-bump composition (1 = SnPb,

● = Pb-free).

YZV PACKAGE

TERMINALS ASSIGNMENTS (YZP PACKAGE)

B

ON

GND

A

VIN

VOUT

2

1

TERMINAL FUNCTIONS

NO.

NAME

DESCRIPTION

B1

GND

Ground

B2

ON

Switch control input, active high. Do not leave floating

A1

VOUT

Switch output

A2

VIN

Switch input, bypass this input with a ceramic capacitor to ground

2

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Product Folder Link(s): TPS22934