3

Embedding of capacitors in finished assemblies

In many applications, finished circuit assemblies are embedded in plastic resins. In this case,

both chemical and thermal influences of the embedding ("potting") and curing processes must be

taken into account.

Our experience has shown that the following potting materials can be recommended: non-flexible

epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum

curing temperature of 100

°C.

Caution:

Consult us first if you wish to embed uncoated types!

B32572, B32573

Page 13 of 19

Please read Cautions and warnings and

Important notes at the end of this document.