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LM5109ASDX Datasheet(PDF) 2 Page - National Semiconductor (TI) |
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LM5109ASDX Datasheet(HTML) 2 Page - National Semiconductor (TI) |
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2 / 9 page ![]() Connection Diagrams Ordering Information Ordering Number Package Type NSC Package Drawing Supplied As LM5109AMA SOIC-8 M08A 95 Units in anti static rails LM5109AMAX SOIC-8 M08A 2500 Units on Tape & Reel LM5109ASD LLP-8 SDC08A 1000 Units on Tape & Reel LM5109ASDX LLP-8 SDC08A 4500 Units on Tape & Reel Pin Descriptions Pin # Name Description Application Information SO-8 LLP-8 11 V DD Positive gate drive supply Locally decouple to V SS using low ESR/ESL capacitor located as close to IC as possible. 2 2 HI High side control input The HI input is compatible with TTL input thresholds. Unused HI input should be tied to ground and not left open 3 3 LI Low side control input The LI input is compatible with TTL input thresholds. Unused LI input should be tied to ground and not left open. 44 V SS Ground reference All signals are referenced to this ground. 5 5 LO Low side gate driver output Connect to the gate of the low-side N-MOS device. 6 6 HS High side source connection Connect to the negative terminal of the bootstrap capacitor and to the source of the high-side N-MOS device. 7 7 HO High side gate driver output Connect to the gate of the high-side N-MOS device. 8 8 HB High side gate driver positive supply rail Connect the positive terminal of the bootstrap capacitor to HB and the negative terminal of the bootstrap capacitor to HS. The bootstrap capacitor should be placed as close to IC as possible. Note: For LLP-8 package it is recommended that the exposed pad on the bottom of the package be soldered to ground plane on the PCB and the ground plane should extend out from underneath the package to improve heat dissipation. 20170202 20170203 FIGURE 2. www.national.com 2 |
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