LM48823TL datasheet(14/20 Pages) NSC

14 / 20 page

PCB Layout Guidelines

Minimize trace impedance of the power, ground and all output

traces for optimum performance. Voltage loss due to trace

resistance between the LM48823 and the load results in de-

creased output power and efficiency. Trace resistance be-

tween the power supply and ground has the same effect as a

poorly regulated supply, increased ripple and reduced peak

output power. Use wide traces for power supply inputs and

amplifier outputs to minimize losses due to trace resistance,

as well as route heat away from the device. Proper grounding

improves audio performance, minimizes crosstalk between

channels and prevents switching noise from interfering with

the audio signal. Use of power and ground planes is recom-

mended.

Place all digital components and route digital signal traces as

far as possible from analog components and traces. Do not

run digital and analog traces in parallel on the same PCB lay-

er. If digital and analog signal lines must cross either over or

under each other, ensure that they cross in a perpendicular

fashion.

LM48823TL Demoboard Bill of Materials

Designator

Quantity

Description

C1, C2

2.2µF ±10% 10V X5R Ceramic Capacitor (603) Panasonic

ECJ-1VB1A225K Murata GRM033R6OJ104KE19D

C3 – C5

1µF ±10% 10V Tantalum Capacitor (402) AVX TACK105M010QTA

4.7µF ±10% 6.3V X5R Ceramic Capacitor (603) Panasonic

ECJ-1VB0J475K Murata GRM188R6OJ475KE19D

C7, C8

0.1µF ±10% 6.3V X5R Ceramic Capacitor (201) Panasonic ECJ-

ZEB0J104K Murata GRM188R61A225KE34D

JU1 – JU5

2 Pin Header

JU6, JU7

2 Pin Header

5-Pin I2C Header

LM4823TL

LM48823TL (16-Bump microSMD)

LM48823TL Datasheet(PDF) 14 Page - National Semiconductor (TI)