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LMV762MA Datasheet(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # LMV762MA
Description  Low Voltage, Precision Comparator with Push-Pull Output
PDF  12 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LMV762MA Datasheet(HTML) 3 Page - National Semiconductor (TI)

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5.0V Electrical Characteristics
Unless otherwise specified, all limited guaranteed for T
J = 25°C, VCM = V
+/2, V+ = 5.0V, V− = 0V−. Boldface limits apply at the
temperature extremes.
Symbol
Parameter
Condition
Min
(Note 7)
Typ
(Note 6)
Max
(Note 7)
Units
V
OS
Input Offset Voltage
0.2
1.0
mV
I
B
Input Bias Current (Note 8)
0.2
50
pA
I
OS
Input Offset Current (Note 8)
0.01
5
pA
CMRR
Common Mode Rejection Ratio
0V < V
CM < VCC - 1.3V
80
100
dB
PSRR
Power Supply Rejection Ratio
V+ = 2.7V to 5V
80
110
dB
CMVR
Input Common Mode Voltage
Range
CMRR > 50dB
−.3
3.8
V
V
O
Output Swing High
I
L = 4mA, VID = 200mV
V+ – 0.35
V+ – 0.1
V
Output Swing Low
I
L = −4mA, VID = −200mV
120
250
mV
I
SC
Output Short Circuit Current
(Note 3)
Sourcing, V
O = 2.5V, VID = 200mV
6.0
60
mA
Sinking, V
O = 2.5V, VID = −200mV
6.0
40
I
S
Supply Current
μA
LMV761 (Single Comparator)
225
700
LMV762 (Both Comparators)
450
1400
I
OUT LEAKAGE Output Leakage I @ Shutdown
SD = GND, V
O = 5.0V
0.20
μA
I
S LEAKAGE
Supply Leakage I @ Shutdown
SD = GND, V
CC = 5.0V
0.20
2
μA
t
PD
Propagation Delay
R
L = 5.1kΩ
C
L = 50pF
Overdrive = 5mV
225
ns
Overdrive = 10mV
190
Overdrive = 50mV
120
t
SKEW
Propagation Delay Skew
5
ns
t
r
Output Rise Time
10% to 90%
1.7
ns
t
f
Output Fall Time
90% to 10%
1.5
ns
t
on
Turn On Time from Shutdown
4
μs
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test condition, see the Electrical Characteristics.
Note 2: Unless otherwise specified human body model is 1.5k
Ω in series with 100pF. Machine model 200pF.
Note 3: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that T
J = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ >
T
A. See Application section for information on temperature de-rating of this device. Absolute Maximum Rating indicate junction temperature limits beyond which
the device may be permanently degraded, either mechanically or electrically.
Note 4: The maximum power dissipation is a function of T
J(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is
P
D = (TJ(MAX)-TA)θJA. All numbers apply for packages soldered directly into a PC board.
Note 5: Maximum temperature guarantee range is −40°C to 125°C.
Note 6: Typical values represent the most likely parametric norm.
Note 7: All limits are guaranteed by testing or statistical analysis.
Note 8: Guaranteed by design
Note 9: Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150°C. Output current in excess of ±25 mA over long term may adversely affect reliability.
3
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