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HT2DC20S20 Datasheet(PDF) 10 Page - NXP Semiconductors |
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HT2DC20S20 Datasheet(HTML) 10 Page - NXP Semiconductors |
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10 / 16 page ![]() 2001 Oct 01 10 Philips Semiconductors Product specification HITAG 2 stick transponder HT2DC20S20 MGW174 Bmin Bmax Fig.3 Definition of modulation index. Definitions: m B max B min – B max B min + ----------------------------------- = m read B max B min – = MECHANICAL CHARACTERISTICS The transponder is sealed in epoxy resin moulding compound. The designation of the package is SOT385-1 (see Chapter “Package outline”). PARAMETER VALUE Mechanical dimensions 12 × 6 × 3mm Protection class IP67 Casting material epoxy resin Transponder IC type HT2ICS20 |
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