Thermoelectric

Module

Construction

N-andP-typesemiconductorelementsareconnectedinaspecificsequenceandsolderedbetween

two ceramic plates. Direct voltage, applied to the TEM’s leads, provides heat absorption on the surface

of one of the ceramic plates and heat emanation at the opposite plate. Thus, the effect of heat pump is

achieved. The temperature difference between the opposite sides of TEM may reach up to 70 °C.

The thermoelectric Module (TEM) is a solid

semiconductor thermoelectric device. Its operation

is based on the Peltier effect. For containers of

limited dimensions TEM provides and maintains

volume temperature below ambient temperature.

Type

Paramertres

Thick-

ness,

mm

I

U

Q

DТ

R,Ом

One stage TEMs

TEM31-1,4-1,620,0х20,0

6

4

≥13

≥70

0,5

3,4

TEM71-1,4-1,630,0х30,0

6

9

≥29

≥70

1,2

3,4

TEM127-1,4-1,638,0х38,0

6

16

≥53

≥70

2,2

3,4

TEM127-1,4-1,640,0х40,0

6

16

≥53

≥70

2,2

4,0

TEM2x63-1,4-1,6*40,0х40,0

6

8 x 2

≥27,0x2

≥70

1,1

3,4

TEM199-1,4-1,650,0х50,0

6

25

≥84

≥70

3,5

3,4

TEM127-2,0-1,251,0х51,0

16

16

≥148

≥69

0,8

3,1

TЭM127-1,0-1,230,0x30,0

3,6

14,2

≥34

≥70

3,2

3,1

TЭM127-1,0-1,630,0x30,0

2,6

13,5

≥25

≥70

4,3

3,5

TЭM127-1,0-2,030,0x30,0

2,1

13,2

≥20

≥70

5,4

3,9

TЭM127-1,0-2,530,0x30,0

1,6

12,2

≥16

≥70

6,7

4,4

TЭM127-1,4-1,240,0x40,0

7,1

14,5

≥67

≥70

1,7

3,6

TЭM127-1,4-2,540,0x40,0

3,6

15,0

≥33

≥70

3,4

4,9

TЭM241-1,0-1,640,0x40,0

2,6

26,0

≥48

≥70

8,2

3,5

TЭM161-1,2-1,540,0x40,0

4,1

18,0

≥50

≥70

3,6

3,4

TЭM199-1,4-1,250,0x50,0

7,1

22,5

≥100

≥70

2,6

3,1

TЭM127-2,0-1,651,0x51,0

11,1

14,5

≥100

≥70

1,1

3,4

TЭM72-3,0-1,451,0x51,0

11,6

3,5

≥85

≥50

0,24

4,15

TЭM219-1,4-1,654,0x54,0

5,6

26,0

≥89

≥70

3,93

3,5

TЭM241-1,4-1,254,4x54,4

7,1

27,5

≥120

≥70

3,1

3,1

Two stage TEMs

2TEM72/127-240,0х40,0

5

16

≥34

≥70

2,6

7,3

2TEM128/127-140,0х40,0

6

16

≥35

≥70

2,4

7,1

2TEM72/127-340,0х40,0

7,5

20

≥36

≥70

2,0

7,8

RIF Corporation manufactures according to your request a TEM having heat transfer

surfaces from 20x20mm2 up to 51x51mm2 with the current maximum from 2 up to 100A

and a maximum ∆T of about 70 K.

5

http://www.rifcorp.ru/

e-mail: corporation@rifcorp.ru

Microelectronics • Thick-Film

Heating • Thermoelectric Cooling