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T7100 Datasheet(PDF) 39 Page - Intel Corporation |
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T7100 Datasheet(HTML) 39 Page - Intel Corporation |
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39 / 87 page ![]() Datasheet 39 Electrical Specifications NOTES: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. VIL is defined as the maximum voltage level at a receiving agent that is interpreted as a logical low value. 3. VIH is defined as the minimum voltage level at a receiving agent that is interpreted as a logical high value. 4. VIH and VOH may experience excursions above VCCP. However, input signal drivers must comply with the signal quality specifications. 5. This is the pull-down driver resistance. Measured at 0.31*VCCP. RON (min) = 0.4*RTT, RON (typ) = 0.455*RTT, RON (max) = 0.51*RTT. RTT typical value of 55 Ω is used for RON typ/ min/max calculations. 6. GTLREF should be generated from VCCP with a 1%-tolerance resistor divider. The VCCP referred to in these specifications is the instantaneous VCCP. 7. RTT is the on-die termination resistance measured at VOL of the AGTL+ output driver. Measured at 0.31*VCCP. RTT is connected to VCCP on die. 8. Specified with on die RTT and RON turned off. Vin between 0 and VCCP. 9. Cpad includes die capacitance only. No package parasitics are included. 10. This is the external resistor on the comp pins. 11. On die termination resistance measured at 0.33*VCCP. Table 11. AGTL+ Signal Group DC Specifications Symbol Parameter Min Typ Max Unit Notes1 VCCP I/O Voltage 1.00 1.05 1.10 V GTLREF Reference Voltage 2/3 VCCP V6 RCOMP Compensation Resistor 27.23 27.5 27.78 Ω 10 RODT Termination Resistor 55 Ω 11 VIH Input High Voltage GTLREF+0.10 VCCP VCCP+0.10 V 3,6 VIL Input Low Voltage -0.10 0 GTLREF-0.10 V 2,4 VOH Output High Voltage VCCP-0.10 VCCP VCCP 6 RTT Termination Resistance 50 55 61 Ω 7 RON Buffer On Resistance 22 25 28 Ω 5 ILI Input Leakage Current ±100 µA 8 Cpad Pad Capacitance 1.6 2.1 2.55 pF 9 |
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