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MAX9323ETP Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX9323ETP
Description  One-to-Four LVCMOS-to-LVPECL Output Clock and Data Driver
PDF  11 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX9323ETP Datasheet(HTML) 2 Page - Maxim Integrated Products

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One-to-Four LVCMOS-to-LVPECL
Output Clock and Data Driver
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC = 3.0V to 3.6V, outputs terminated with 50
Ω ±1% to (VCC - 2V), CLK_SEL = VCC or GND, CLK_EN = VCC, TA = -40°C to +85°C,
unless otherwise noted. Typical values are at VCC = 3.3V, TA = +25°C.) (Notes 1, 2, and 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to GND ...........................................................-0.3V to +4.0V
Q_, Q_, CLK_, CLK_SEL,
CLK_EN to GND .....................................-0.3V to (VCC + 0.3V)
Continuous Output Current .................................................50mA
Surge Output Current........................................................100mA
Continuous Power Dissipation (TA = +70°C)
20-Pin TSSOP (derate 11mW/°C)..............................879.1mW
20-Pin 4mm ✕ 4mm Thin QFN (derate 16.9mW/°C)...1349.1mW
Junction-to-Ambient Thermal Resistance in Still Air
20-Pin TSSOP ............................................................+91°C/W
20-Pin 4mm ✕ 4mm Thin QFN.................................+59.3°C/W
Junction-to-Case Thermal Resistance
20-Pin TSSOP ............................................................+20°C/W
20-Pin 4mm ✕ 4mm Thin QFN......................................+2°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Soldering Temperature (10s) ...........................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
INPUTS (CLK0, CLK1, CLK_SEL, CLK_EN)
CLK0, CLK1
2
VCC
Input High Voltage
VIH
Figure 1
CLK_EN, CLK_SEL
2
VCC
V
CLK0, CLK1
0
1.3
Input Low Voltage
VIL
Figure 1
CLK_EN, CLK_SEL
0
0.8
V
CLK0, CLK1, CLK_SEL = VCC
150
Input High Current
IIH
CLK_EN = VCC
-5
+5
µA
CLK0, CLK1, CLK_SEL = GND
-5
+5
Input Low Current
IIL
CLK_EN = GND
-150
µA
Input Capacitance
CIN
CLK0, CLK1, CLK_SEL, CLK_EN (Note 4)
4
pF
OUTPUTS (Q_, Q_)
Single-Ended Output High
Voltage
VOH
Figure 1
VCC -
1.4
VCC -
1.0
V
Single-Ended Output Low
Voltage
VOL
Figure 1
VCC -
2.0
VCC -
1.7
V
Differential Output Voltage
VOD
Figure 1, VOD = VOH - VOL
0.6
0.85
V
SUPPLY
Supply Current (Note 5)
ICC
25
mA



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