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BSR316P Datasheet(PDF) 2 Page - Infineon Technologies AG |
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BSR316P Datasheet(HTML) 2 Page - Infineon Technologies AG |
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2 / 9 page ![]() BSR316P Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - ambient R thJA minimal footprint, steady state - - 250 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=-250 µA - - -100 V Gate threshold voltage V GS(th) V DS=V GS, I D=-170 µA -2 -1.5 -1 Zero gate voltage drain current I DSS V DS=-100 V, V GS=0 V, T j=25 °C - -0.1 -1 µA V DS=-100 V, V GS=0 V, T j=150 °C - -10 -100 Gate-source leakage current I GSS V GS=-20 V, V DS=0 V - -10 -100 nA Drain-source on-state resistance R DS(on) V GS=-4.5 V, I D=-0.33 A - 1.8 2.2 Ω V GS=-10 V, I D=-0.36 A - 1.3 1.8 Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=-0.29 A 0.3 0.5 - S Values Rev 1.05 page 2 2009-02-16 |
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