MPC8377E datasheet(125/126 Pages) FREESCALE

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MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

125

Document Revision History

02/2009

• In Table 3, “Recommended Operating Conditions,” added two new rows for 800 MHz, and created two

rows for SerDes. In addition, changed 666 to 667 MHz.

•In Table 5, “MPC8378E Power Dissipation 1,” added Notes 4 and 5. In addition, changed 666 to 667

MHz.

•In Table 13, “DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V,” Table 21, “DDR1 and

DDR2 SDRAM Output AC Timing Specifications,” and Table 72, “TePBGA II Pinout Listing,” added

footnote to references to MVREF, MDQ, and MDQS, referencing AN3665, MPC837xE Design Checklist.

•In Table 21, updated tDDKHCX minimum value for 333 MHz to 2.40.

•In Table 72, “TePBGA II Pinout Listing,” added footnote to USBDR_STP_SUSPEND and modified

footnote 10 and added footnote 14.

•In Table 74, “Operating Frequencies for TePBGA II,” changed 667 to 800 MHz for core_clk.

•In Table 80, “Example Clock Frequency Combinations,” added 800 MHz cells for e300 core.

• Updated part numbering information in AF column in Table 84, “Part Numbering Nomenclature.” In

addition, modified extended temperature information in notes 1 and 4.

•In Table 85, “Available Parts (Core/DDR Data Rate),” added new row for 800/400 MHz.

12/2008 Initial public release.

Table 87. Document Revision History (continued)

Revision

Date

Substantive Change(s)

MPC8377E Datasheet(PDF) 125 Page - Freescale Semiconductor, Inc