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MPC8379E Datasheet(PDF) 96 Page - Freescale Semiconductor, Inc

Part # MPC8379E
Description  PowerQUICC II Pro Processor Hardware Specifications
PDF  116 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8379E Datasheet(HTML) 96 Page - Freescale Semiconductor, Inc

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MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
96
Freescale Semiconductor
Package and Pin Listings
AVDD_C
AD13
Power for e300
core PLL (1.0 V
or 1.05 V)
—16
AVDD_L
F13
Power for eLBC
PLL (1.0 V or
1.05 V)
—16
AVDD_P
F12
Power for
system PLL
(1.0 V or 1.05 V)
—16
GVDD
A2, D2, R2, U2, AC2, AF2, AJ2, F3, H3, L3,
N3, Y3, AB3, B4, P4, AF4, AH4, C5, F5, K5,
V5, AA5, AD5, N6, R6, AJ6, B7, E7, K7, AA7,
AE7, AG7, AD8
Power for DDR
SDRAM I/O
Voltage (2.5 or
1.8 V)
GVDD
—
OVDD
AC10, AF12, AJ12, K23, Y23, R24, AD24,
L25, W25, AB26, U27, M28, Y28, G10, A11,
C11
PCI, USB, and
other Standard
(3.3 V)
OVDD
—
No Connect
NC
F16, F17, AD16, AD17
—
—
8
Pull Down
Pull Down
B16, AH18
—
—
7
Note:
1 This pin is an open drain signal. A weak pull-up resistor (1 k
Ω) should be placed on this pin to OVDD.
2 This pin is an open drain signal. A weak pull-up resistor (2–10 k
Ω) should be placed on this pin to OVDD.
3 This output is actively driven during reset rather than being released to high impedance during reset.
4 These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5 This pin should have a weak pull up if the chip is in PCI host mode. Follow PCI Specification recommendation and see
AN3665, “MPC837xE Design Checklist,” for more details.
6 These are On Die Termination pins, used to control DDR2 memories internal termination resistance.
7 This pin must always be tied to GND using a 0
Ω resistor.
8 This pin must always be left not connected.
9 For DDR2 operation, it is recommended that MDIC0 be tied to GND using an 18.2
Ω resistor and MDIC1 be tied to DDR
power using an 18.2
Ω resistor.
10 This pin must always be tied low. If it is left floating it may cause the device to malfunction.
11 See AN3665, “MPC837xE Design Checklist,” for proper DDR termination.
12 This pin must not be pulled down during PORESET.
13 This pin must always be tied to GND.
14 This pin must always be tied to OVDD.
15 Open or tie to GND.
16 Voltage settings are dependent on the frequency used; see Table 3.
17 See AN3665, “MPC837xE Design Checklist,” for proper eTSEC termination.
Table 69. TePBGA II Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power Supply
Notes



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