STTH110

Characteristics

Doc ID 9344 Rev 2

3/6

Figure 1.

Conduction losses versus average

current

Figure 2.

Forward voltage drop versus

forward current

P(W)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

I

(A)

F(AV)

δ = 1

δ = 0.05

δ = 0.5

δ = 0.2

δ = 0.1

T

tp

I

(A)

FM

0.1

1.0

10.0

100.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

V

(V)

FM

T =25°C

(maximum values)

j

T =150°C

(maximum values)

j

T =150°C

(typical values)

j

Figure 3.

Relative variation of thermal

impedance junction ambient versus

pulse duration (DO-41)

Figure 4.

Relative variation of thermal

impedance junction ambient versus

pulse duration (epoxy FR4) (SMA)

Z/R

th(j-c)

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

t (s)

p

T

tp

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

epoxy FR4, leads = 10 mm

Z/R

th(j-c)

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

t (s)

p

T

tp

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Figure 5.

Thermal resistance junction to

ambient versus copper surface

under each lead (DO-41)

Figure 6.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMA).

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

120

012

34567

89

10

S(cm²)

epoxy printed circuit board FR4, copper thickness: 35 µm

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)

epoxy printed circuit board FR4, copper thickness: 35 µm