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BAT54 Datasheet(PDF) 1 Page - Diodes Incorporated |
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BAT54 Datasheet(HTML) 1 Page - Diodes Incorporated |
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1 / 4 page  BAT54 /A /C /S Document number: DS11005 Rev. 25 - 2 1 of 4 www.diodes.com June 2010 © Diodes Incorporated BAT54 /A /C /S SURFACE MOUNT SCHOTTKY BARRIER DIODE Features • Low Turn-on Voltage • Fast Switching • PN Junction Guard Ring for Transient and ESD Protection • Lead Free/RoHS Compliant (Note 3) • “Green” Molding Compound (No Br, Sb) (Note 4) • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data • Case: SOT-23 • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 • Polarity: See Diagrams Below • Marking Information: See Page 3 • Ordering Information: See Page 2 • Weight: 0.008 grams (approximate) Top View BAT54 BAT54A BAT54C BAT54S Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 30 V Forward Continuous Current (Note 2) IF 200 mA Repetitive Peak Forward Current IFRM 300 mA Forward Surge Current @ t < 1.0s IFSM 600 mA Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 2) PD 200 mW Thermal Resistance, Junction to Ambient Air (Note 2) RθJA 500 °C/W Operating and Storage Temperature Range (Note 5) TJ, TSTG -65 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 1) V(BR)R 30 ⎯ ⎯ V IRS = 100μA Forward Voltage VF ⎯ ⎯ 240 320 400 500 800 mV IF = 0.1mA IF = 1mA IF = 10mA IF = 30mA IF = 100mA Reverse Leakage Current (Note 1) IR ⎯ ⎯ 2.0 μA VR = 25V Total Capacitance CT ⎯ ⎯ 10 pF VR = 1.0V, f = 1.0MHz Reverse Recovery Time trr ⎯ ⎯ 5.0 ns IF = 10mA through IR = 10mA to IR = 1.0mA, RL = 100Ω Notes: 1. Short duration test pulse used to minimize self-heating effect. 2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 3. No purposefully added lead. 4. Products manufactured with date code VD (Week 50, 2008) and newer are built with Green Molding Compound. Products manufactured with date code prior to VD are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RθJA |
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