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BZX84C8V2 Datasheet(PDF) 1 Page - Diodes Incorporated |
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BZX84C8V2 Datasheet(HTML) 1 Page - Diodes Incorporated |
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1 / 4 page ![]() BZX84C2V4 - BZX84C39 Document number: DS18001 Rev. 28 - 2 1 of 4 www.diodes.com April 2010 © Diodes Incorporated BZX84C2V4 - BZX84C39 350mW SURFACE MOUNT ZENER DIODE Features • Planar Die Construction • 350mW Power Dissipation • Zener Voltages from 2.4V - 39V • Ideally Suited for Automated Assembly Processes • Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 3 and 4) • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data • Case: SOT-23 • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 • Polarity: See Diagram • Marking Information: See Page 3 • Ordering Information: See Page 3 • Weight: 0.008 grams (approximate) Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Forward Voltage @ IF = 10mA VF 0.9 V Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 1) PD 300 mW Power Dissipation (Note 2) PD 350 mW Thermal Resistance, Junction to Ambient Air (Note 1) RθJA 417 °C/W Thermal Resistance, Junction to Ambient Air (Note 2) RθJA 357 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Valid provided the terminals are kept at ambient temperature. 3. No purposefully added lead. Halogen and Antimony Free. 4. Product manufactured with Data Code OW (week 42, 2009) and newer are built with Green Molding Compound. Product manufactured prior to Date Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. Top View Device Schematic Please click here to visit our online spice models database. |
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